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Plastic Chips to Enable New Applications

British firm Plastic Logic plans to invest $100 million in the one of the first factories to manufacture plastic electronics on a commercial scale

Production is planned to start already end of 2008 in the new factory located in Dresden, Germany, according to Simon Jones, Vice president Product Development of British firm Plasitc Logic (Cambridge, UK). The company’s initial focus will be on plastic chips for flexible displays. They will be equally bendable as credit cards are, said Jones [1]. Market volume of these active-matrix display modules for applications in portable electronics devices is predicted to reach 41.6 million units until 2010 [2].
Plastic Chips to Enable New Applications
© Plastic Logic Limited 2007
  US company E-Ink manufactures this kind of displays already now to be used in handsets of Motorola and for Polymer Vision’s (Eindhoven, NL) rollable ‘take anywhere, read anywhere’ electronic reader products [3]. In March, Nanoident Technologies AG celebrated the opening of the world’s first fab for printed semiconductor-based optoelectronic devices. Nanoident’s Organic Fab (OFAB) in Linz, AT, will supply its products for healthcare, personal and military safety, as well as for novel industrial applications to companies of the Nanoident group [4]. „Definitely a field to watch is foil sensorics“, explained Gerhard Klink, project manager for polymer electronics at the Fraunhofer Institute for Reliability and Microintegration (FhG-IZM, Berlin, DE) in an interview with the Financial Times Deutschland. He could well imagine an adhesive wound patch, which provides data about the healing process, he said [1].
  Many experts, however, regard printed electronics not to compete directly with Silicon chips. Rather, growth potential derives from printed electronics opening up access to new applications and tap new markets. Instead of traditional electronic devices, printed electronics will take on the form of “wallpaper”: posters, patches, and packaging material [5]. First prototypes are available sewn into cloths—technology on the catwalk.

  1. NN, Small Times, PennWell, January 4, 2007
  2. D. Dilba, Financial Times Deutschland, Gruner & Jahr, 4. Januar 2007
  3. NN, Electronics Weekly, ReedElsevier, February 14, 2007
  4. M. Courtemanche, Advanced Packaging, PennWell, February 21, 2007
  5. D. Ridsdale, MicroNanoSystems, Angel Business Communications, 13 March 2007
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